Multiple backplane connectors are assembled on the edge of a daughter card (DC) PCB and the top of a mother board (MB) PCB, forming an array. Location tolerance mismatches exist between the connectors on the DC PCB and MB PCB. This tolerance mismatch creates shear stress on the SMT solder joints, which can lead to breaking of solder joints , an increase in the DC PCB assembly force, broken insulator housings, and bent pins due to the location mismatch of mating contacts.

The Techniz floating head technology solves these issues.

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