The critical concern about SMT soldering, when it comes to large high-density connectors, is solder bridging and opens due to the connector solder tail coplanarity and PCB warpage.

The Techniz self-adjusting solder tail technology enables secure soldering of large connectors. Each solder tail is soldered to a main contact on the connector. The solder tails do not need to touch the solder paste before reflow, which resolves the solder bridging problem. During reflow, each solder tail moves down independently, fitting to the height of the PCB at that location. In fact, the weight of the solder tail is not enough to move the solder tail down with gravity alone. The unique Techniz solder tail design makes the connection happen in a predictable, controlled process.

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Before Reflow