Features
Floating head technology reduces SMT solder joint stress from connector linear location tolerance mismatch, while eliminating the chance of contact pin damage during daughter card PCB assembly. The head of the daughter card connector can move laterally as much as 1.0mm to accommodate mismatch tolerance.

Self-adjusting solder tail technology ensures secure SMT soldering. Each solder tail sits above the solder paste when the connector is set on the PCB. Each solder tail then, moves down onto molten solder during reflow, finding the right height to match any warpage in the PCB.

The throughput of the G-Flex Backplane Connector has been measured to be at least 20 Gbps. The linear density of connector is 82 differential pairs per inch at 25.4 mm card pitch. Customized signal routing is available with no increase in cost.

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