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  Techniz is a leading innovator in the field of high-speed interconnection for the telecommunications, data communications, server, medical, and consumer electronics markets. The interconnection technologies developed by Techniz improve not only electrical performance, but mechanical and thermal performance as well. The Techniz product family includes backplane connectors, stacking connectors, and FPC connectors.

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Techniz Announces SST Technology License Agreement with Fujitsu
San Jose, CA, and Sunnyvale, CA, July 10, 2007
Techniz, Inc., a high-growth startup developing a new generation of high-speed interconnection systems for use within electronic products, today announced a license agreement with Fujitsu Component Limited (TSE: 6719).
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Featured Product

Introducing G-FLEX
G-Flex Technology Diagram

 
•20+ Gbps signal speed
•Density of 82 pairs / inch
•Floating head technology
•SMT termination

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